SEMI - Semiconductor Equipment and Materials International

02/14/2018 | Press release | Distributed by Public on 02/14/2018 18:19

2018FLEX Japan Targets Flexible Hybrid Electronics Technology and Applications

TOKYO - February 14, 2018 -2018FLEX Japan, the leading Flexible Hybrid Electronics (FHE) conference and exhibition in Japan, will assemble top experts April 19-20, 2018, in Tokyo for the latest in both flexible electronics and MEMS and sensors. For the first time, the event will co-locate with the MEMS & Sensors Forum to spotlight FHE and MEMS and sensors technologies and enabling applications ranging from Internet of Things (IoT) to medtech in the Japan region. Registration for the event is now open.

The two-day event offers two networking events for innovation, partnership and business opportunities, as well as four technical sessions:

  • FHE and Printed Electronics
  • IoT Applications
  • MEMS and Sensors
  • Textiles

The four sessions will feature 16 FHE technologists and experts from Japan, America, Asia and Europe representing organizations and academia including:

  • Jeremy Burroughes, CTO, Cambridge Display Technology Ltd.
  • Bair Wilfried, senior engineering manager, NextFlex
  • Michael D. McCreary, vice president and CTO, E Ink Corporation
  • Jam Khan, vice president, Professional Service & Business Development, Software Monetization, Gemalto N.V.
  • Ichiro Amimori, co-founder and CEO, Xenoma Inc.
  • Shuichi Gennaka, general manager, Development Dept. Technical Center general manager, Suminoe Textile Co., Ltd.
  • Simon Jones, commercial director, FlexEnable Limited

2018FLEX Japan will also showcase tabletop exhibits by FHE, MEMS and sensors manufacturing supply chain players and electronics companies integrating these technologies. Additional information is available here and at Customer Services, SEMI Japan - [email protected]; +81.3.3222.5988.

About SEMI

SEMIĀ® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (SEMI-MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit and follow SEMI on LinkedIn and Twitter.

Association Contact

Yoichiro Ando
SEMI Japan
Phone: 81.3.3222.5854
Email: [email protected]