Vice President & Chief Financial Officer (Form 6-K)

Vice President & Chief Financial Officer

TSMC Board of Directors Meeting Resolutions

Hsinchu, Taiwan, R.O.C., June 9, 2021 - TSMC (TWSE: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. In response to the COVID-19 pandemic and relevant orders issued by the government, the board approved a change to the date of TSMC's 2021 Annual Shareholders' Meeting from June 8, 2021 to July 26, 2021, and the location of the meeting will remain at Ambassador Hotel Hsinchu (10F, No. 188, Section 2, Zhonghua Road, Hsinchu).

2. Approved the distribution of a NT$2.75 per share cash dividend for the first quarter of 2021, and set September 22, 2021 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be September 16, 2021. As required by Article 165 of Taiwan's Company Law, the shareholders' register shall be closed for five days prior to the record date (September 18 through September 22, 2021) for registration transfer, and the dividend will be paid on October 14, 2021. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be September 16, 2021. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be September 17, 2021.

3.Approved capital appropriations of approximately US$9,290.7 million (approximately NT$255,572.1 million) for purposes including: 1) Installation and upgrade of advanced technology capacity; 2) Installation of specialty technology capacity; 3) Fab construction, installation of fab facility systems, and capitalized leased assets; 4) Third quarter 2021 R&D capital investments and sustaining capital expenditures.

4. Approved the promotion of Corporate Planning Organization's Senior Director of Strategic Planning Division Mr. Jonathan Lee to Vice President.

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world's largest dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

TSMC Spokesperson:

Media Contacts:

Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901

Nina Kao

Head of Public Relations

Tel: 886-3-5636688 ext.7125036

Mobile: 886-988-239-163

E-Mail: [email protected]

Baker Li

Public Relations

Tel: 886-3-5636688 ext.7125037

Mobile: 886-988-932-757

E-Mail: [email protected]