05/03/2019 | Press release | Distributed by Public on 05/03/2019 11:23
Munich, Germany - 3 May 2019 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is the major player in power semiconductors, it empowers a world of unlimited energy. At the PCIM 2019 tradeshow, Infineon is launching power products and solutions that will make a difference and deliver customers a cutting edge in competition. The new product offerings will be introduced in a press conference at PCIM on Tuesday, 7 May, starting at 3.30 PM.
Product highlights for an energy-efficient world
With the safe completion of the production ramp of its Silicon Carbide (SiC) MOSFET base technology, Infineon enters high volume production of a comprehensive discrete product portfolio of 1200 V CoolSiC™ MOSFET devices. The discrete SiC portfolio comprises seven different on-resistance ratings available in both, TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650 V CoolSiC MOSFET product family, which will be launched soon.
The CoolGaN™ 600 V e-mode HEMT devices together with the GaN EiceDRIVER™ ICs open up new levels of efficiency for high performance applications. Several demonstrators at the tradeshow will be there to explore Infineon's GaN solution in next-generation server, data center, telecom, motor drives, charging and adapter applications.
The 48 V architecture for hyperscale data centers is evolving. Enabling highest efficiency and power density for this innovative design, allowing for an easy transition path from 12 V to 48 V, Infineon's new proprietary zero-voltage-switching switched-capacitor converter (ZSC) is a technology to rely on. The ZSC board will also be showcased, shedding a light on future infrastructure for big data.
At PCIM 2019, Infineon will introduce the Easy 3B package making the Easy family the broadest power module portfolio at 12 mm height without base plate. Easy 3B is the platform to extend current inverter design to achieve higher power without changing much on the mechanical side. The new package inherits many of the advantages of the family portfolio such as the flexible pin-grid system for customizing.
Extending its large portfolio of high voltage devices, the new package XHP™ 3 will be showcased, a flexible IGBT module platform for high-power applications in the voltage range from 3,3 kV up to 6,5 kV. The module allows for scalable designs with best-in-class reliability and highest power density. Due to its symmetrical design with low stray inductance it offers significantly improved switching behavior: a solution for demanding applications such as traction and commercial, construction and agricultural vehicles as well as medium-voltage drives.
Infineon will present the first member of a new family of magnetic current sensors at PCIM 2019. The coreless HALL sensor XENSIV™ TLI4971 provides an accurate and stable current measurement in industrial applications. It offers a high level of flexibility as customers can individually program product parameters such as the current range, the overcurrent threshold and the output mode.
For its automotive customers, Infineon will launch four new derivatives of the HybridPACK™ Drive power module for main inverters in hybrid and electric vehicles. They are optimized for different inverter performance levels between 100 kW and 200 kW. Since all members of the product family have an identical footprint, they allow for inverter performance to be scaled quickly and without a major system redesign.
Other PCIM 2019 highlights include:
Infineon at the PCIM 2019
At the PCIM 2019 tradeshow, Infineon is presenting innovative product-to-system solutions for applications that are set to power the world and shape the future. Infineon's demos are presented at booth #313 in hall 9 (Nuremberg, Germany, 7-9 May 2019). Information about the PCIM show highlights is available at www.infineon.com/pcim.