Patent Granted for System and Method for Unloading IC Units

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled "System and Method for Unloading IC Units" has been officially granted in Malaysia as Patent No. MY-200158-A. Malaysia Patent No.MY-200158-A will have a life of twenty years from the application date 07 Aug 2018.

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