Supplement to The Unsecured Corporate Bond Issuance Authorized by the Board of Director Resolution Dated Aug 12th, 2021.

 Supplement to The Unsecured Corporate
Bond Issuance Authorized by the Board of
Director Resolution Dated Aug 12th, 2021.

1.Date of the board of directors resolution:NA
2.Name [issue no.__ of (secured, unsecured) corporate bonds of
___________ (company)]:
Hon Hai Precision Industry Co., Ltd. 3rd. unsecured corporate bond issue
in 2021
3.Total amount issued:Aggregate amount NTD 12,150,000,000
4.Face value per bond:NTD 1,000,000
5.Issue price:At Par
6.Issuance period:3-year,5-year,7-year and 10-year.
7.Coupon rate:
Fixed rate at 0.55% p.a.(3-year), 0.63% p.a.(5-year) ,
0.72% p.a.(7-year)and 0.82% p.a.(10-year)
8.Types, names, monetary values and stipulations of collaterals:NA
9.Use of the funds raised by the offering and utilization plan:
Repay short-term debt
10.Underwriting method:public offering through underwriters
11.Trustees of the corporate bonds:Bank Sinopac Co., Ltd.
12.Underwriter or agent:
MasterLink Securities Corp. as a lead underwriter
13.Guarantor(s) for the issuance:NA
14.Agent for payment of the principal and interest:
Bank Sinopac Co., Ltd. Cheng Chung Branch.
15.Certifying institution:NA
16.Where convertible into shares, the rules for conversion:NA
17.Sell-back conditions:NA
18.Buyback conditions:NA
19.Reference date for any additional share exchange, stock swap, or
subscription:NA
20.Possible dilution of equity in case of any additional share exchange,
stock swap, or subscription:NA
21.Any other matters that need to be specified:None