WAFER WORKS CORPORATION 7th Unsecured Convertible Bond will be listed on the TPEx from June 27, 2021.

WAFER WORKS CORPORATION 7th Unsecured Convertible Bond will be listed on the TPEx from June 27, 2021.

Date: 2021/07/23

1. Issuer: WAFER WORKS CORPORATION
(1) Bond name: WAFER WORKS CORPORATION 7th Unsecured Convertible Bond
(2) Code: 61827
(3) Issue amount: TWD 300 million
(4) Issue price: 100% (TWD 100)
(5) Issue date: June 27, 2021
(6) Maturity date: June 27, 2026
(7) Tenor: 5 years
(8) Coupon rate: 0%
2. For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).