09/27/2023 | Press release | Distributed by Public on 09/26/2023 18:01
TAICHUNG, Taiwan- 2023-09-27- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company's new customized ultra-bandwidth elements (CUBE) enable memory technology to be optimized for seamless performance running generative AI on hybrid edge/cloud applications.
CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions. Designed to meet the growing demands of edge AI computing devices, it is compatible with memory density from 256Mb to 8Gb with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.
Winbond is taking a major step forward with CUBE, enabling seamless deployment across various platforms and interfaces. The technology is suited to advanced applications such as wearable and edge server devices, surveillance equipment, ADAS, and co-robots
"The CUBE architecture enables a paradigm shift in AI deployment," says Winbond. "We believe that the integration of cloud AI and powerful edge AI will define the next phase of AI development. With CUBE, we are unlocking new possibilities and paving the way for improved memory performance and cost optimization on powerful Edge AI device."
CUBE's key features include:
"CUBE can unleash the full potential of hybrid edge/cloud AI to elevate system capabilities, response time, and energy efficiency," Winbond added. "Winbond's commitment to innovation and collaboration will enable developers and enterprises to drive advancement across various industries."
Winbond is actively engaging with partner companies to establish the 3DCaaS platform, which will leverage CUBE's capabilities. By integrating CUBE with existing technologies, Winbond aims to offer cutting-edge solutions that empower businesses to thrive in the era of AI-driven transformation.
About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.
Spokesperson
Chih-Chung Chou
Chief Financial Officer
TEL: +886-3-567-8168/+886-987-365-682