03/06/2024 | Press release | Distributed by Public on 03/05/2024 19:23
The Japan Society of Applied Physics (JSAP) Spring Meeting will be held in the Tokyo City University from March 22 to 25. A hybrid event will be held this year, too.<_o3a_p>
ULVAC will give an invited talk about advanced packaging technologies, the entitle is "Development of 3D・chiplet integration technologies for the AI and IoT".<_o3a_p>
Please join us!<_o3a_p>
DATE | 2024. 3. 22 (Fri) |
TIME | 1:40pm~2:10pm (JST) |
LOCATION | Setagaya Campus, Tokyo City University & On-line |
CATEGORY | 13. Semiconductor |
PRESENTATION INFORMATION | Oral Presentation (Invited) | Room 61C |
SYMPOSIUM TITLE | "Progress in the semiconductor industry contributing to expand IoT market and what's core technologies ?"(Organize:The Study Group of the Integrated MEMS of the JSAP) |
INVITED TALK TITLE | "Development of 3D・chiplet integration technologies for the AI and IoT"<_o3a_p> |
External Links
- https://meeting.jsap.or.jp/english/symposium
For further information
ULVAC, Inc. web_info