Material Event (Form 8-K)

Termination of a Material Definitive Agreement.

On May 14, 2021, Bionano Genomics, Inc. (the 'Company') executed a payoff letter to repay in full all amounts due and owing, and terminate all commitments and obligations under that certain Loan and Security Agreement, dated as of March 14, 2019, as amended (the 'Loan Agreement'), with East West Bank and Innovatus Life Sciences Lending Fund I, LP (the 'Lenders'). Pursuant to the payoff letter, the Company has agreed to pay to the Lenders approximately $17.1 million, which includes pay-off amounts for principal, interest, fees, reimbursement of expenses and other items. The material terms of the Loan Agreement are described in the Company's Form 10-Q filed with the Securities and Exchange Commission on May 13, 2021.

The foregoing summary of the Loan Agreement does not purport to be complete and is subject to, and qualified in its entirety by reference to (i) the Loan Agreement, which was filed as Exhibit 10.2 to the Company's Form 8-K on March 14, 2019, (ii) the Waiver and First Amendment to the Loan Agreement, dated June 25, 2019, between the Company and the Lenders, which was filed as Exhibit 10.1 to the Company's Form 10-Q on August 8, 2019, (iii) the Second Amendment to the Loan Agreement, dated March 6, 2020, between the Company and the Lenders, which was filed as Exhibit 10.49 to the Company's Form 10-K on March 10, 2020, (iv) the Consent and Third Amendment to the Loan Agreement, dated August 21, 2020, between the Company and the Lenders, which was filed as Exhibit 10.4 to the Company's Form 10-Q on November 13, 2020 and (v) the Fourth Amendment to the Loan Agreement, dated December 30, 2020, between the Company and the Lenders, which was filed as Exhibit 10.44 to the Company's Form 10-K on March 23, 2021, each of which are incorporated herein by reference.